Hutchinson Technology Inc.
TDK Worldwide
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PLATING
Plating Capabilities
Electroplating: Copper, Nickel, Gold, and Silver
Electro-less plating: Nickel pattern plating with photoresist
Vacuum deposited seed layers for plating on non-conductive substrates
Soft, Pure Gold: Best in class for wire bonding or solder bonding
Hard gold also available
Stainless steel substrate for direct pattern gold plating supported
Dimensions and Tolerances
Typical thickness: 0.1 µm to 20 µm
Typical thickness tolerance: ±10% to ±50% of target
Product size: 1mm to 600mm
Plated vias down to 0.1 mm (Outside diameter of copper pad, Inside of 0.025 mm via diameter)
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Process Control and Product Quality Methods
Real-time monitoring and control of plating bath chemistries and process conditions for superior product quality
Thickness control: XRF
Bond ability and cleanliness: Solder wettability XPS and gold ball shear
Plated film integrity: Heat and humidity stress test, porosity, bending, and stress-strain test
Plated film characterization grain size and structure optimization using focused ion beam (FIB) cross-section
Plating thickness uniformity: Thickness uniformity optimization using COMSOL FEA modeling
Plating Support Operations
Engineering development capabilities for optimized surface finish, cost and performance
World class analytical chemistry lab for control of contamination levels (exceeding industry standards)
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