Plating Capabilities

• Electroplating: Copper, Nickel, Gold, and Silver
• Electro-less plating: Nickel pattern plating with photoresist
• Vacuum deposited seed layers for plating on non-conductive substrates
• Soft, Pure Gold: Best in class for wire bonding or solder bonding
• Hard gold also available
• Stainless steel substrate for direct pattern gold plating supported

    Dimensions and Tolerances

• Typical thickness: 0.1 µm to 20 µm
• Typical thickness tolerance: ±10% to ±50% of target
• Product size: 1mm to 600mm
• Plated vias down to 0.1 mm (Outside diameter of copper pad, Inside of 0.025 mm via diameter)

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    Process Control and Product Quality Methods

• Real-time monitoring and control of plating bath chemistries and process conditions for superior product quality
• Thickness control: XRF
• Bond ability and cleanliness: Solder wettability XPS and gold ball shear
• Plated film integrity: Heat and humidity stress test, porosity, bending, and stress-strain test
• Plated film characterization grain size and structure optimization using focused ion beam (FIB) cross-section
• Plating thickness uniformity: Thickness uniformity optimization using COMSOL FEA modeling

    Plating Support Operations

• Engineering development capabilities for optimized surface finish, cost and performance
• World class analytical chemistry lab for control of contamination levels (exceeding industry standards)