Physical Vapor Deposition is a process for applying very thin layers of material. The process provides superior uniformity, adhesion, and process flexibility. Physical Vapor Deposition is typically used to deposit pure metals. However, alloys, ceramics, and in some cases polymers, can be sputter deposited.
In our laboratories and production facilities, we have numerous pieces of equipment with varying capabilities that allow us to experiment with new techniques and materials, produce piece parts in small to medium volume, and produce large volumes of material in roll-to-roll format. Our most fundamental tool is capable of performing evaporation and DC, RF, or reactive sputtering with tunable in-situ ion treatment.
Sputter deposition of thin films can be used for a variety of applications. Sputter deposited coatings can be a cost effective way to improve wear, reflectivity, aesthetics, corrosion resistance, permeability resistance, adhesion, friction, surface energy, electrical conductivity, and more.